Low-Power AI Silicon
Chip design focused on inference efficiency, stable deployment, and energy-aware execution.
Low-Power Silicon for High-Bandwidth Inference
High-Bandwidth AI Inference Infrastructure
MarsLab builds low-power AI chips and high-bandwidth inference infrastructure to extract more intelligence from every watt, every byte of memory bandwidth, and every inference cycle.
Technology
Large-model deployment is moving from peak FLOPS alone toward sustained token production under memory, power, and system constraints.
Chip design focused on inference efficiency, stable deployment, and energy-aware execution.
A roadmap toward 3D-stacked memory architecture that brings memory closer to logic and reduces data movement cost.
Runtime, compiler, kernel, memory layout, NoC, and KV cache decisions feed back into hardware architecture.
Architecture
Traditional high-end GPU systems often rely on 2.5D packaging with HBM beside the compute die. MarsLab is designing toward tighter logic-memory integration for decode-heavy inference workloads.
2.5D package, HBM beside compute die, general-purpose software stack, and high memory movement cost in decode-heavy workloads.
3D-stacked memory, logic closer to memory, runtime-guided data placement, and KV cache-aware execution.
Roadmap
M100 helps MarsLab enter real deployment constraints today. M200 is the next-generation high-bandwidth inference architecture, designed for workload-dependent gains in decode-heavy scenarios.
For inference deployment and software validation.
Next-generation architecture for decode-heavy inference workloads.
Real workloads → runtime tuning → system deployment → silicon iteration → faster inference.
Careers
We are hiring across chip architecture, DFT, RTL, physical design, verification, runtime, compiler, and AI infra.
Contact
For company inquiries and careers, contact the MarsLab HR team.
Email: hr@marslabai.com